HCPL-7850100
vs
ACPL-7900-500E
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
HEWLETT PACKARD CO
|
BROADCOM INC
|
| Part Package Code |
DIP
|
|
| Package Description |
SOJ, SMDIP8,.3
|
DIP, GWDIP8,.4
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
ISOLATION AMPLIFIER
|
ISOLATION AMPLIFIER
|
| Bandwidth (3dB)-Nom |
100 MHz
|
0.2 MHz
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
e3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
105 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOJ
|
DIP
|
| Package Equivalence Code |
SMDIP8,.3
|
GWDIP8,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage Limit-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
HYBRID
|
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Gain-Max |
8.4
|
8.44
|
| Voltage Gain-Min |
7.6
|
7.95
|
| Base Number Matches |
3
|
2
|
| Factory Lead Time |
|
14 Weeks
|
| Samacsys Manufacturer |
|
Avago Technologies
|
| Isolation Voltage-Min |
|
5000 V
|
| Length |
|
9.8 mm
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
4.7 mm
|
| Supply Current-Max |
|
18.5 mA
|
| Width |
|
7.62 mm
|
|
|
|
Compare HCPL-7850100 with alternatives
Compare ACPL-7900-500E with alternatives