HCPL-788J
vs
ISO255P
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
AVAGO TECHNOLOGIES INC
|
BURR-BROWN CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP16,.4
|
DIP, DIP28,.6
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Samacsys Manufacturer |
Avago Technologies
|
|
| Amplifier Type |
ISOLATION AMPLIFIER
|
ISOLATION AMPLIFIER
|
| Bandwidth (3dB)-Nom |
0.03 MHz
|
0.05 MHz
|
| Isolation Voltage-Min |
5000 V
|
1500 V
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDMA-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
10.312 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP16,.4
|
DIP28,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.911 mm
|
|
| Supply Current-Max |
40 mA
|
55 mA
|
| Supply Voltage Limit-Max |
5.5 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Gain-Max |
8.3333
|
|
| Voltage Gain-Min |
7.5397
|
|
| Width |
7.5 mm
|
|
| Base Number Matches |
9
|
1
|
| Common Mode Voltage-Max |
|
1500 V
|
| Technology |
|
HYBRID
|
|
|
|
Compare HCPL-788J with alternatives
Compare ISO255P with alternatives