HCPL-788J500 vs IL612-3ETR7 feature comparison

HCPL-788J500 Hewlett Packard Co

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IL612-3ETR7 NVE Corporation

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Part Life Cycle Code Transferred Active
Ihs Manufacturer HEWLETT PACKARD CO NVE CORP
Part Package Code SOIC SOIC
Package Description , SOP,
Pin Count 16 16
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type ISOLATION AMPLIFIER ISOLATION AMPLIFIER
Bandwidth (3dB)-Nom 30 MHz
Isolation Voltage-Min 3750 V
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Number of Functions 1 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Supply Voltage Limit-Max 5.5 V 7 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Voltage Gain-Max 8.332
Voltage Gain-Min 7.539
Base Number Matches 3 1
Rohs Code Yes
Common Mode Voltage-Max 400 V
Length 9.9 mm
Package Code SOP
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.8 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm

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Compare IL612-3ETR7 with alternatives