HCPL-788J500
vs
MP227A
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
HEWLETT PACKARD CO
|
ANALOGIC CORP
|
| Part Package Code |
SOIC
|
MODULE
|
| Package Description |
,
|
DIP, DIP16,2.4
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
ISOLATION AMPLIFIER
|
ISOLATION AMPLIFIER
|
| Bandwidth (3dB)-Nom |
30 MHz
|
0.005 MHz
|
| Isolation Voltage-Min |
3750 V
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-XDMA-P16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage Limit-Max |
5.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
PIN/PEG
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Gain-Max |
8.332
|
1000
|
| Voltage Gain-Min |
7.539
|
10
|
| Base Number Matches |
3
|
1
|
| Rohs Code |
|
No
|
| Common Mode Voltage-Max |
|
750 V
|
| JESD-609 Code |
|
e0
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP16,2.4
|
| Supply Current-Max |
|
5 mA
|
| Technology |
|
HYBRID
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare HCPL-788J500 with alternatives
Compare MP227A with alternatives