HCPL-9000-300
vs
HCPL-9000-500E
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
AGILENT TECHNOLOGIES INC
|
AVAGO TECHNOLOGIES INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP,
|
DIP,
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
|
| JESD-30 Code |
R-PDSO-G8
|
|
| JESD-609 Code |
e0
|
|
| Length |
9.65 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
SOP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
3.81 mm
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
6.35 mm
|
|
| Base Number Matches |
3
|
3
|
| Pbfree Code |
|
Yes
|
| Samacsys Manufacturer |
|
Avago Technologies
|
|
|
|
Compare HCPL-9000-300 with alternatives
Compare HCPL-9000-500E with alternatives