HCPL-9030-500
vs
HCPL-9030-300E
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
BROADCOM INC
|
AGILENT TECHNOLOGIES INC
|
Package Description |
DIP-8
|
SOP,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Avago Technologies
|
|
Base Number Matches |
3
|
1
|
Part Package Code |
|
SOIC
|
Pin Count |
|
8
|
Analog IC - Other Type |
|
ANALOG CIRCUIT
|
JESD-30 Code |
|
R-PDSO-G8
|
JESD-609 Code |
|
e3
|
Length |
|
9.65 mm
|
Moisture Sensitivity Level |
|
1
|
Number of Functions |
|
1
|
Number of Terminals |
|
8
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
SOP
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
3.81 mm
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
TIN
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
Width |
|
6.35 mm
|
|
|
|
Compare HCPL-9030-500 with alternatives
Compare HCPL-9030-300E with alternatives