HCS360-I/P
vs
HCS360/P
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
0.300 INCH, PLASTIC, DIP-8
|
0.300 INCH, PLASTIC, DIP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
|
| Factory Lead Time |
6 Weeks
|
6 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
9.271 mm
|
9.46 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
5.334 mm
|
4.32 mm
|
| Supply Current-Max |
1.6 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Telecom IC Type |
DATA ENCRYPTION CIRCUIT
|
DATA ENCRYPTION CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare HCS360-I/P with alternatives
Compare HCS360/P with alternatives