HCS500T/SM
vs
HCS410/P
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
0.207 INCH, PLASTIC, SOIC-8
|
0.300 INCH, PLASTIC, DIP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5.28 mm
|
9.271 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP8,.25
|
DIP8,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.03 mm
|
5.334 mm
|
| Supply Current-Max |
2.4 mA
|
3.5 mA
|
| Supply Voltage-Nom |
5 V
|
3 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
|
| Telecom IC Type |
DATA ENCRYPTION CIRCUIT
|
DATA ENCRYPTION CIRCUIT
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
5.21 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
6 Weeks
|
| Screening Level |
|
TS 16949
|
|
|
|
Compare HCS500T/SM with alternatives
Compare HCS410/P with alternatives