HCS500T/SM
vs
HCS500/P
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOIC
|
DIP
|
Package Description |
0.207 INCH, PLASTIC, SOIC-8
|
0.300 INCH, PLASTIC, DIP-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.31.00.01
|
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
JESD-609 Code |
e3
|
e3
|
Length |
5.28 mm
|
9.46 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP8,.25
|
DIP8,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.03 mm
|
4.32 mm
|
Supply Current-Max |
2.4 mA
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Telecom IC Type |
DATA ENCRYPTION CIRCUIT
|
DATA ENCRYPTION CIRCUIT
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
Width |
5.21 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Power Supplies |
|
3.3/5 V
|
|
|
|
Compare HCS500T/SM with alternatives
Compare HCS500/P with alternatives