HD14013BFP vs HCC4013BF feature comparison

HD14013BFP Renesas Electronics Corporation

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HCC4013BF SGS-Ates Componenti Electronici SPA

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Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP SGS-ATES COMPONENTI ELECTRONICI S P A
Part Package Code SOIC
Package Description SOP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-XDIP-T14
Length 10.06 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 350 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm
fmax-Min 7 MHz
Base Number Matches 2 2
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 400 ns
Terminal Finish Tin/Lead (Sn/Pb)

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