HD26C32AFP
vs
DS26LV31TM/NOPB
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HITACHI LTD
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP16,.3
|
SOP, SOP16,.25
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Input Characteristics |
DIFFERENTIAL SCHMITT TRIGGER
|
STANDARD
|
| Interface IC Type |
LINE RECEIVER
|
LINE DRIVER
|
| Interface Standard |
EIA-422-A; EIA-423-A
|
EIA-422-B; TIA-422-B; V.11
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Length |
10.06 mm
|
9.9 mm
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Low Current-Max |
0.006 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.3
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
25 ns
|
|
| Receiver Number of Bits |
4
|
|
| Seated Height-Max |
2.2 mm
|
1.75 mm
|
| Supply Current-Max |
23 mA
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.5 mm
|
3.9 mm
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Differential Output |
|
YES
|
| Driver Number of Bits |
|
4
|
| High Level Input Current-Max |
|
0.00001 A
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Out Swing-Min |
|
2 V
|
| Output Characteristics |
|
3-STATE
|
| Output Polarity |
|
COMPLEMENTARY
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Transmit Delay-Max |
|
16 ns
|
|
|
|
Compare HD26C32AFP with alternatives
Compare DS26LV31TM/NOPB with alternatives