HD3SS215IZQET
vs
BU16027KV
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ROHM CO LTD
|
Package Description |
,
|
LFQFP, QFP64,.47SQ,20
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
CONSUMER CIRCUIT
|
CONSUMER CIRCUIT
|
JESD-30 Code |
S-PBGA-B50
|
S-PQFP-G64
|
JESD-609 Code |
e1
|
e2
|
Length |
5 mm
|
10 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
50
|
64
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
LFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1 mm
|
1.6 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN COPPER
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
5 mm
|
10 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
QFP
|
Pin Count |
|
64
|
Package Equivalence Code |
|
QFP64,.47SQ,20
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max |
|
150 mA
|
|
|
|
Compare HD3SS215IZQET with alternatives
Compare BU16027KV with alternatives