HD6852
vs
HD6852P
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HITACHI LTD
|
HITACHI LTD
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP, DIP24,.6
|
DIP, DIP24,.6
|
Pin Count |
24
|
24
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
MODEM CONTROL CAPABILITY
|
MODEM CONTROL CAPABILITY
|
Address Bus Width |
1
|
1
|
Boundary Scan |
NO
|
NO
|
Bus Compatibility |
6800
|
6800
|
Clock Frequency-Max |
1 MHz
|
1 MHz
|
Communication Protocol |
SYNC, BYTE; BISYNC; EXT SYNC
|
SYNC, BYTE; BISYNC; EXT SYNC
|
Data Encoding/Decoding Method |
NRZ
|
NRZ
|
Data Transfer Rate-Max |
0.0732421875 MBps
|
0.0732421875 MBps
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
R-CDIP-T24
|
R-PDIP-T24
|
JESD-609 Code |
e0
|
e0
|
Low Power Mode |
NO
|
NO
|
Number of DMA Channels |
|
|
Number of I/O Lines |
|
|
Number of Serial I/Os |
1
|
1
|
Number of Terminals |
24
|
24
|
On Chip Data RAM Width |
|
|
Operating Temperature-Max |
75 °C
|
75 °C
|
Operating Temperature-Min |
-20 °C
|
-20 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP24,.6
|
DIP24,.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
0
|
0
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
4.75 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
NMOS
|
NMOS
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
Base Number Matches |
3
|
1
|
Length |
|
31.6 mm
|
Seated Height-Max |
|
5.7 mm
|
Width |
|
15.24 mm
|
|
|
|