HD74AC32T vs M38510/30501BDX feature comparison

HD74AC32T Renesas Electronics Corporation

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M38510/30501BDX NXP Semiconductors

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Part Package Code SOIC DFP
Package Description TSSOP, DFP,
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 1989-09-01
Additional Feature ALSO OPERATES WITH 5V SUPPLY
Family AC LS
JESD-30 Code R-PDSO-G14 R-GDFP-F14
Length 5 mm
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code TSSOP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH FLATPACK
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 10 ns 35 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS TTL
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING FLAT
Terminal Pitch 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 4.4 mm
Base Number Matches 2 7
Screening Level MIL-PRF-38535 Class B

Compare HD74AC32T with alternatives

Compare M38510/30501BDX with alternatives