HD74HC00FP vs CD74HC00EE4 feature comparison

HD74HC00FP Renesas Electronics Corporation

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CD74HC00EE4 Texas Instruments

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer RENESAS ELECTRONICS CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC DIP
Package Description SOP, SOP14,.3 DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 10.06 mm 19.305 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.0052 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 23 ns 27 ns
Propagation Delay (tpd) 115 ns 135 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 2.2 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20 NOT SPECIFIED
Width 5.5 mm 7.62 mm
Base Number Matches 2 1
Samacsys Manufacturer Texas Instruments
JESD-609 Code e4
Packing Method TUBE
Power Supply Current-Max (ICC) 0.04 mA
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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