HD74HC00FP vs MM74HC00SJX feature comparison

HD74HC00FP Renesas Electronics Corporation

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MM74HC00SJX Fairchild Semiconductor Corporation

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Source Content uid HD74HC00FP MM74HC00SJX
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC SOP
Package Description SOP, SOP14,.3 SOP, SOP14,.3
Pin Count 14 14
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 10.06 mm 10.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 4 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.3 SOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Power Supplies 2/6 V 2/6 V
Prop. Delay@Nom-Sup 23 ns 23 ns
Propagation Delay (tpd) 115 ns 113 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 2.2 mm 2.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20 30
Width 5.5 mm 5.3 mm
Base Number Matches 2 3
Manufacturer Package Code 14LD,SOP,EIAJ TYPE II, 5.3MM WIDE
ECCN Code EAR99
JESD-609 Code e3
Packing Method TR
Terminal Finish MATTE TIN

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