HD74HC00FP-E vs 74HC03DB-Q100 feature comparison

HD74HC00FP-E Renesas Electronics Corporation

Buy Now Datasheet

74HC03DB-Q100 Nexperia

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NEXPERIA
Part Package Code SOIC
Package Description SOP, SSOP,
Pin Count 14
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 10.06 mm 6.2 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 115 ns 145 ns
Qualification Status Not Qualified
Seated Height-Max 2.2 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.5 mm 5.3 mm
Base Number Matches 1 2
Date Of Intro 2017-02-01
JESD-609 Code e4
Output Characteristics OPEN-DRAIN
Peak Reflow Temperature (Cel) 260
Screening Level AEC-Q100
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare HD74HC00FP-E with alternatives

Compare 74HC03DB-Q100 with alternatives