HD74HC00FP-E vs MM74HC132MTCX feature comparison

HD74HC00FP-E Renesas Electronics Corporation

Buy Now Datasheet

MM74HC132MTCX Fairchild Semiconductor Corporation

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC TSSOP
Package Description SOP, 4.40 MM, MO-153, TSSOP-14
Pin Count 14 14
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 10.06 mm 5 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 115 ns 125 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 5.5 mm 4.4 mm
Base Number Matches 1 5
Manufacturer Package Code 14 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE
ECCN Code EAR99
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code TSSOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 37 ns
Schmitt Trigger YES
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare HD74HC00FP-E with alternatives

Compare MM74HC132MTCX with alternatives