HD74HC00P
vs
MC74HC00ANG
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP14,.3
|
|
| Pin Count |
14
|
|
| Reach Compliance Code |
unknown
|
|
| HTS Code |
8542.39.00.01
|
|
| Family |
HC/UH
|
|
| JESD-30 Code |
R-PDIP-T14
|
|
| JESD-609 Code |
e4
|
|
| Length |
19.2 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
NAND GATE
|
|
| Max I(ol) |
0.004 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
|
| Number of Inputs |
2
|
|
| Number of Terminals |
14
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP14,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Prop. Delay@Nom-Sup |
23 ns
|
|
| Propagation Delay (tpd) |
115 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Schmitt Trigger |
NO
|
|
| Seated Height-Max |
5.06 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
|
|
|
|
Compare HD74HC00P with alternatives