HD74HC00P
vs
8403701CA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MOTOROLA INC
Part Package Code
DIP
Package Description
DIP, DIP14,.3
,
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T14
S-CQCC-N20
JESD-609 Code
e4
Length
19.2 mm
8.89 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Prop. Delay@Nom-Sup
23 ns
Propagation Delay (tpd)
115 ns
135 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
5.06 mm
2.03 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
7.62 mm
8.89 mm
Base Number Matches
2
5
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Compare HD74HC00P with alternatives
Compare 8403701CA with alternatives