HD74HC00RP vs 74HC00N,652 feature comparison

HD74HC00RP Renesas Electronics Corporation

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74HC00N,652 NXP Semiconductors

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Pbfree Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Part Package Code SOIC DIP
Package Description SOP, 0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14
Pin Count 14 14
Manufacturer Package Code PRSP0014DE SOT27-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Renesas Electronics NXP
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T14
Length 8.65 mm 19.025 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 115 ns 135 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 7.62 mm
Base Number Matches 2 1
Rohs Code Yes
ECCN Code EAR99
Factory Lead Time 4 Weeks
kg CO2e/kg 12.4
Average Weight (mg) 1630.6
CO2e (mg) 20219.441
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method BULK
Prop. Delay@Nom-Sup 27 ns
Schmitt Trigger NO
Terminal Finish NICKEL PALLADIUM GOLD

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