HD74HC00RP vs HD74HC00RPEL feature comparison

HD74HC00RP Hitachi Ltd

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HD74HC00RPEL Renesas Electronics Corporation

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Part Life Cycle Code Transferred Active
Ihs Manufacturer HITACHI LTD RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP14,.25 SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Prop. Delay@Nom-Sup 23 ns 23 ns
Propagation Delay (tpd) 115 ns 115 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.95 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
kg CO2e/kg 12.4
Average Weight (mg) 215.8
CO2e (mg) 2675.92
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 20

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Compare HD74HC00RPEL with alternatives