HD74HC00RP vs M54HC00F1R feature comparison

HD74HC00RP Renesas Electronics Corporation

Buy Now Datasheet

M54HC00F1R STMicroelectronics

Buy Now Datasheet
Pbfree Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP STMICROELECTRONICS
Part Package Code SOIC DIP
Package Description SOP, DIP, DIP14,.3
Pin Count 14 14
Manufacturer Package Code PRSP0014DE
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Renesas Electronics
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-GDIP-T14
Length 8.65 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 115 ns 22 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 7.62 mm
Base Number Matches 2 1
Rohs Code No
kg CO2e/kg 12.4
Average Weight (mg) 1630.6
CO2e (mg) 20219.441
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 22 ns
Schmitt Trigger NO
Terminal Finish TIN LEAD

Compare HD74HC00RP with alternatives

Compare M54HC00F1R with alternatives