HD74HC00RP vs MM74HC132MTCX feature comparison

HD74HC00RP Hitachi Ltd

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MM74HC132MTCX Fairchild Semiconductor Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC TSSOP
Package Description SOP, SOP14,.25 4.40 MM, MO-153, TSSOP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Equivalence Code SOP14,.25 TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup 23 ns 37 ns
Propagation Delay (tpd) 115 ns 125 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Seated Height-Max 1.75 mm 1.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 3.9 mm 4.4 mm
Base Number Matches 2 5
Pbfree Code Yes
Rohs Code Yes
Manufacturer Package Code 14 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE
ECCN Code EAR99
kg CO2e/kg 12.4
Average Weight (mg) 62.85
CO2e (mg) 779.34
JESD-609 Code e4
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

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