HD74HC00RPEL
vs
74HC132N
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP, SOP14,.25
|
SOT-27-1, DIP-14
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDIP-T14
|
| Length |
8.65 mm
|
19.025 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Max I(ol) |
0.004 A
|
0.004 A
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP14,.25
|
DIP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Packing Method |
TR
|
BULK
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
23 ns
|
31 ns
|
| Propagation Delay (tpd) |
115 ns
|
38 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
YES
|
| Seated Height-Max |
1.75 mm
|
4.2 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
3.95 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
EAR99
|
| JESD-609 Code |
|
e4
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare HD74HC00RPEL with alternatives
Compare 74HC132N with alternatives