HD74HC01RP vs JM38510/65001BCA feature comparison

HD74HC01RP Hitachi Ltd

Buy Now Datasheet

JM38510/65001BCA Texas Instruments

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer HITACHI LTD TEXAS INSTRUMENTS INC
Part Package Code SOIC DIP
Package Description FP-14DN HERMETIC SEALED, CERAMIC, DIP-14
Pin Count 14 14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-GDIP-T14
JESD-609 Code e0 e0
Length 8.65 mm 19.94 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.0052 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Prop. Delay@Nom-Sup 23 ns 27 ns
Propagation Delay (tpd) 115 ns 135 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 2 3
Pbfree Code Yes
ECCN Code EAR99
Additional Feature LG-MAX
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.04 mA
Screening Level MIL-M-38510 Class B
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare HD74HC01RP with alternatives

Compare JM38510/65001BCA with alternatives