HD74HC01RP vs SN54HC00J feature comparison

HD74HC01RP Renesas Electronics Corporation

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SN54HC00J Texas Instruments

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer RENESAS ELECTRONICS CORP TEXAS INSTRUMENTS INC
Part Package Code SOIC DIP
Package Description SOP, HERMETIC SEALED, CERAMIC, DIP-14
Pin Count 14 14
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-GDIP-T14
Length 8.65 mm 19.94 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 115 ns 135 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code No
ECCN Code EAR99
Samacsys Manufacturer Texas Instruments
Additional Feature LG-MAX
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max I(ol) 0.0052 A
Package Equivalence Code DIP14,.3
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.04 mA
Prop. Delay@Nom-Sup 27 ns
Schmitt Trigger NO
Screening Level 38535Q/M;38534H;883B
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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