HD74HC01RPEL vs SNJ54HC00J feature comparison

HD74HC01RPEL Renesas Electronics Corporation

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SNJ54HC00J Rochester Electronics LLC

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer RENESAS ELECTRONICS CORP ROCHESTER ELECTRONICS LLC
Part Package Code SOIC DIP
Package Description SOP, SOP14,.25 HERMETIC SEALED, CERAMIC, DIP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-GDIP-T14
Length 8.65 mm 19.94 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Prop. Delay@Nom-Sup 23 ns
Propagation Delay (tpd) 115 ns 135 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.95 mm 7.62 mm
Base Number Matches 1 2
Additional Feature LG-MAX
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level MIL-PRF-38535
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare HD74HC01RPEL with alternatives

Compare SNJ54HC00J with alternatives