HD74HC09T vs MM74HC08MTC feature comparison

HD74HC09T Renesas Electronics Corporation

Buy Now Datasheet

MM74HC08MTC Fairchild Semiconductor Corporation

Buy Now Datasheet
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC TSSOP
Package Description TSSOP, 4.40 MM, MO-153, TSSOP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 5 mm 5 mm
Logic IC Type AND GATE AND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 115 ns 121 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 4 4
Pbfree Code Yes
Rohs Code Yes
Manufacturer Package Code 14 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE
ECCN Code EAR99
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP14,.25
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 35 ns
Schmitt Trigger NO
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare HD74HC09T with alternatives

Compare MM74HC08MTC with alternatives