HD74HC107RP vs 74HC107D,653 feature comparison

HD74HC107RP Renesas Electronics Corporation

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74HC107D,653 NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Contact Manufacturer Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, PLASTIC, SO-14
Pin Count 14 14
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e4
Length 8.65 mm 8.65 mm
Logic IC Type J-K FLIP-FLOP J-K FLIP-FLOP
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 190 ns 48 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Width 3.95 mm 3.9 mm
Base Number Matches 2 2
Manufacturer Package Code SOT108-1
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
fmax-Min 60 MHz

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Compare 74HC107D,653 with alternatives