HD74HC109P vs M38510/30107BEX feature comparison

HD74HC109P Renesas Electronics Corporation

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M38510/30107BEX YAGEO Corporation

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP PHILIPS COMPONENTS
Part Package Code DIP DIP
Package Description DIP, DIP16,.3 DIP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH LS
JESD-30 Code R-PDIP-T16 R-GDIP-T16
Length 19.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type J-KBAR FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 21000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Bits 2 1
Number of Functions 2 4
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 220 ns 55 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.06 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS TTL
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm
Base Number Matches 2 1
Screening Level MIL-PRF-38535 Class B
fmax-Min 25 MHz

Compare HD74HC109P with alternatives

Compare M38510/30107BEX with alternatives