HD74HC109P
vs
MM74HC75J
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
DIP, DIP16,.3
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-PDIP-T16
|
R-GDIP-T16
|
| Length |
19.2 mm
|
19.43 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
J-KBAR FLIP-FLOP
|
D LATCH
|
| Max Frequency@Nom-Sup |
21000000 Hz
|
|
| Max I(ol) |
0.004 A
|
0.004 A
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
2
|
2
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Propagation Delay (tpd) |
220 ns
|
36 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.06 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
HIGH LEVEL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
2
|
| JESD-609 Code |
|
e0
|
| Prop. Delay@Nom-Sup |
|
32 ns
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare HD74HC109P with alternatives
Compare MM74HC75J with alternatives