HD74HC11RPEL vs TC74HC11AFN-ELP feature comparison

HD74HC11RPEL Renesas Electronics Corporation

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TC74HC11AFN-ELP Toshiba America Electronic Components

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP14,.25 SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 25 ns 21 ns
Propagation Delay (tpd) 125 ns 21 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 3.95 mm 3.9 mm
Base Number Matches 1 1
JESD-609 Code e0
Terminal Finish TIN LEAD

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Compare TC74HC11AFN-ELP with alternatives