HD74HC123AFP vs GD74HC123D feature comparison

HD74HC123AFP Renesas Electronics Corporation

Buy Now Datasheet

GD74HC123D LG Semicon Co Ltd

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP LG SEMICON CO LTD
Part Package Code SOIC
Package Description SOP, SOP16,.3 SOP, SOP16,.25
Pin Count 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 1987-05-01
Family HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 10.06 mm
Logic IC Type MONOSTABLE MULTIVIBRATOR MONOSTABLE MULTIVIBRATOR
Moisture Sensitivity Level 1
Number of Data/Clock Inputs 2
Number of Functions 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.3 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 300 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 5.5 mm
Base Number Matches 2 2
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)

Compare HD74HC123AFP with alternatives