HD74HC132P vs 74HCT00D-T feature comparison

HD74HC132P Renesas Electronics Corporation

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74HCT00D-T NXP Semiconductors

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Source Content uid HD74HC132P 74HCT00D-T
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.2 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Packing Method TR TAPE AND REEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Power Supplies 2/6 V 5 V
Prop. Delay@Nom-Sup 25 ns 24 ns
Propagation Delay (tpd) 125 ns 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 5.06 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.62 mm 3.9 mm
Base Number Matches 2 3
JESD-609 Code e4
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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