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HD74HC132P vs 74HCT00N,652 feature comparison

HD74HC132P Renesas Electronics Corporation

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74HCT00N,652 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Pin Count 14 14
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Length 19.2 mm 19.025 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TAPE AND REEL TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Power Supplies 2/6 V 5 V
Prop. Delay@Nom-Sup 25 ns 29 ns
Propagation Delay (tpd) 125 ns 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 5.06 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Manufacturer Package Code SOT27-1
Terminal Finish NICKEL/PALLADIUM/GOLD (NI/PD/AU)

Compare HD74HC132P with alternatives

Compare 74HCT00N,652 with alternatives

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