HD74HC132P vs MM74HCT00M feature comparison

HD74HC132P Renesas Electronics Corporation

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MM74HCT00M Fairchild Semiconductor Corporation

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP FAIRCHILD SEMICONDUCTOR CORP
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 0.150 INCH, MS-012, SOIC-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Length 19.2 mm 8.6235 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Packing Method TR RAIL
Prop. Delay@Nom-Sup 25 ns 29 ns
Propagation Delay (tpd) 125 ns 29 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 5.06 mm 1.753 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 2 5
Manufacturer Package Code 14LD,SOIC,JEDEC MS-012, .150", NARROW BODY
ECCN Code EAR99
JESD-609 Code e3
Peak Reflow Temperature (Cel) 260
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30

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