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HD74HC132P-E vs 74HC00N,652 feature comparison

HD74HC132P-E Renesas Electronics Corporation

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74HC00N,652 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14 14
ECCN Code EAR99 EAR99
HTS Code 8542.31.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e4
Length 19.2 mm 19.025 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 125 ns 135 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.06 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD NICKEL/PALLADIUM/GOLD (NI/PD/AU)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Manufacturer Package Code SOT27-1
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Packing Method BULK PACK
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 27 ns
Schmitt Trigger NO

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Compare 74HC00N,652 with alternatives

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