HD74HC132P-E vs MC74HC00AD feature comparison

HD74HC132P-E Renesas Electronics Corporation

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MC74HC00AD Freescale Semiconductor

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description DIP, SOP, SOP14,.25
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e4 e0
Length 19.2 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 125 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.06 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 5
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code SOP14,.25
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 22 ns
Schmitt Trigger NO

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