HD74HC132RP vs 933668880652 feature comparison

HD74HC132RP Renesas Electronics Corporation

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933668880652 NXP Semiconductors

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Part Package Code SOIC DIP
Package Description SOP, DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e0 e4
Length 8.65 mm 19.025 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 125 ns 29 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 2 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare 933668880652 with alternatives