HD74HC132RPEL vs 74HC00DB,112 feature comparison

HD74HC132RPEL Renesas Electronics Corporation

Buy Now Datasheet

74HC00DB,112 NXP Semiconductors

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Part Package Code SOIC SSOP1
Package Description SOP, SOP14,.25 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14
Pin Count 14 14
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Equivalence Code SOP14,.25 SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Packing Method TR TUBE
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 25 ns 27 ns
Propagation Delay (tpd) 125 ns 135 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 1.75 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20 30
Width 3.95 mm 5.3 mm
Base Number Matches 1 2
Manufacturer Package Code SOT337-1
Factory Lead Time 4 Weeks
JESD-609 Code e4
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

Compare HD74HC132RPEL with alternatives

Compare 74HC00DB,112 with alternatives