HD74HC137RP-EL vs HD74HC137RPEL feature comparison

HD74HC137RP-EL Renesas Electronics Corporation

Buy Now Datasheet

HD74HC137RPEL Renesas Electronics Corporation

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code compliant unknown
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm 9.9 mm
Logic IC Type OTHER DECODER/DRIVER 3-LINE TO 8-LINE DECODER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 225
Propagation Delay (tpd) 300 ns 305 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm 3.95 mm
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.39.00.01
Input Conditioning LATCHED
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code SOP16,.25
Packing Method TR
Prop. Delay@Nom-Sup 60 ns

Compare HD74HC137RP-EL with alternatives

Compare HD74HC137RPEL with alternatives