HD74HC151T vs TC74HC257AFN(ELP) feature comparison

HD74HC151T Renesas Electronics Corporation

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TC74HC257AFN(ELP) Toshiba America Electronic Components

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Part Life Cycle Code Contact Manufacturer Lifetime Buy
Ihs Manufacturer RENESAS ELECTRONICS CORP TOSHIBA CORP
Part Package Code TSSOP SOIC
Package Description TSSOP, SOP,
Pin Count 16 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 5 mm 9.9 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 1 4
Number of Inputs 8 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Propagation Delay (tpd) 51 ns 35 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 4.4 mm 3.9 mm
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
Load Capacitance (CL) 150 pF
Output Characteristics 3-STATE
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare HD74HC151T with alternatives

Compare TC74HC257AFN(ELP) with alternatives