HD74HC153FPEL
vs
5962R9580501VX
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
DIE
|
| Package Description |
SOP, SOP16,.3
|
DIE,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G16
|
S-XUUC-N16
|
| Length |
10.06 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.004 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
2
|
4
|
| Number of Inputs |
4
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
DIE
|
| Package Equivalence Code |
SOP16,.3
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
29 ns
|
|
| Propagation Delay (tpd) |
145 ns
|
37 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.2 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
5.5 mm
|
|
| Base Number Matches |
1
|
2
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
| Total Dose |
|
100k Rad(Si) V
|
|
|
|
Compare HD74HC153FPEL with alternatives
Compare 5962R9580501VX with alternatives