HD74HC251FP-EL vs MM74HC251SJX feature comparison

HD74HC251FP-EL Renesas Electronics Corporation

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MM74HC251SJX Fairchild Semiconductor Corporation

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Pbfree Code Yes Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS TECHNOLOGY CORP FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code unknown compliant
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 10.06 mm 10.1 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 8 8
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 245 ns 256 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.5 mm 5.3 mm
Base Number Matches 2 2
HTS Code 8542.39.00.01
JESD-609 Code e3
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code SOP16,.3
Packing Method TR
Prop. Delay@Nom-Sup 49 ns
Terminal Finish MATTE TIN

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Compare MM74HC251SJX with alternatives