HD74HC273FP-EL vs MM74HC273MX feature comparison

HD74HC273FP-EL Renesas Electronics Corporation

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MM74HC273MX Fairchild Semiconductor Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer RENESAS TECHNOLOGY CORP FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP20,.4
Pin Count 20 20
Reach Compliance Code unknown unknown
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 12.6 mm 12.8 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Terminals 20 20
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.65 mm
Surface Mount YES YES
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.5 mm 7.5 mm
Base Number Matches 2 1
Rohs Code No
HTS Code 8542.39.00.01
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 21000000 Hz
Max I(ol) 0.004 A
Number of Bits 8
Number of Functions 1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Polarity TRUE
Package Equivalence Code SOP20,.4
Packing Method TR
Propagation Delay (tpd) 170 ns
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Trigger Type POSITIVE EDGE
fmax-Min 24 MHz

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