HD74HC273T-EL vs MC74HC273ADT feature comparison

HD74HC273T-EL Hitachi Ltd

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MC74HC273ADT onsemi

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer HITACHI LTD ON SEMICONDUCTOR
Part Package Code SOIC TSSOP
Package Description TSSOP, TSSOP, TSSOP20,.25
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 6.5 mm 6.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 180 ns 220 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 4.4 mm 4.4 mm
Base Number Matches 2 5
Rohs Code Yes
Factory Lead Time 4 Weeks
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP20,.25
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Terminal Finish NICKEL PALLADIUM GOLD
fmax-Min 24 MHz

Compare HD74HC273T-EL with alternatives

Compare MC74HC273ADT with alternatives