HD74HC688RPEL
vs
MM74HC688MTCX
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
SOIC
|
TSSOP
|
| Package Description |
SOP, SOP20,.4
|
4.40 MM, MO-153, TSSOP-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| Length |
12.8 mm
|
6.5 mm
|
| Logic IC Type |
IDENTITY COMPARATOR
|
MAGNITUDE COMPARATOR
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP20,.4
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
265 ns
|
220 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
4.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.5 mm
|
4.4 mm
|
| Base Number Matches |
2
|
1
|
| Additional Feature |
|
CASCADABLE
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare HD74HC688RPEL with alternatives
Compare MM74HC688MTCX with alternatives