HD74LS02P vs N74LS02N feature comparison

HD74LS02P Renesas Electronics Corporation

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N74LS02N Philips Semiconductors

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Not Recommended Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP PHILIPS SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Pin Count 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 1986-11-01
Family LS
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Length 19.2 mm
Logic IC Type NOR GATE NOR GATE
Max I(ol) 0.008 A 0.008 A
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 75 °C 70 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 5.4 mA 5.4 mA
Prop. Delay@Nom-Sup 15 ns 15 ns
Propagation Delay (tpd) 15 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 5.06 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 2 4
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)

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