HD74LS125ARP-E
vs
SN74LS125ADR2
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
MOTOROLA INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP14,.25
|
SOIC-14
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Control Type |
ENABLE LOW
|
ENABLE LOW
|
| Family |
LS
|
LS
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| Length |
8.65 mm
|
8.65 mm
|
| Load Capacitance (CL) |
45 pF
|
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Max I(ol) |
0.024 A
|
0.024 A
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
75 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP14,.25
|
SOP14,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Power Supply Current-Max (ICC) |
20 mA
|
20 mA
|
| Prop. Delay@Nom-Sup |
18 ns
|
18 ns
|
| Propagation Delay (tpd) |
18 ns
|
18 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.95 mm
|
3.9 mm
|
| Base Number Matches |
1
|
4
|
| JESD-609 Code |
|
e0
|
| Packing Method |
|
TR
|
| Supply Voltage-Max (Vsup) |
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
|
4.75 V
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare HD74LS125ARP-E with alternatives